是否使用氮气取决于焊锡膏焊剂的化学特性。
The use of nitrogen will depend on the solder paste flux chemistry.
三种焊锡膏均可形成饱满、光亮的焊点，锡铅焊点外观比无铅焊点更规整圆滑。
All of the three solder pastes could form plump and splendid solder point, and the appearance of Sn-Pb solder point was more regular and sleek.
某些焊锡膏对于镀锡表面具有良好的效果，但对裸铜osp的焊接效果则很差。
Some pastes do well with tinned surfaces but solder poorly bare copper OSP.
焊锡粉是焊锡膏的主要成分，其质量的好坏对焊锡膏的印刷质量起着至关重要的作用。
Solder powder is the main component of solder paste, and the quality of paste print mostly depend on the solder powder.
阐述了国内外免清洗焊剂和无铅焊锡膏的研究现状及其在电子组装技术中的应用前景。
The research on and the application in the electronic assembly technology of the two materials are reviewed.
阐述了国内外免清洗焊剂和无铅焊锡膏的研究现状及其在电子组装技术中的应用前景。
The research on and the application in the electronic assembly technology of the two materials are reviewed.
应用推荐