热敏薄膜电阻制备是非致冷微测辐射热计红外焦平面的一项关键技术。
Preparation of thermal sensitive thin film resistor is one of key technologies in uncooled micro bolometer IR FPA fabrication.
选定多形硅薄膜为微测辐射热计热敏层，并重点从光学和热学两方面对微测辐射热计结构进行了优化设计。
Polymorphous silicon film was selected to be thermal-resistance layer of micro-bolometer, and we optimized the structure of micro-bolometer through optical and thermal design.
选定多形硅薄膜为微测辐射热计热敏层，并重点从光学和热学两方面对微测辐射热计结构进行了优化设计。
Polymorphous silicon film was selected to be thermal-resistance layer of micro-bolometer, and we optimized the structure of micro-bolometer through optical and thermal design.
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