本文对局部经受高温热循环构件的热弹塑性应力进行了有限元分析。
In this paper, the thermal elastic-plastic stresses of the components which underwent local high temperature cycle were analyzed by FEM.
采用定点激光反射热循环方法，测量了硅基体上铜膜应力随温度的变化及等温松弛。
The stress variation with temperature and isothermal relaxation in copper films deposited onto silicon wafers are studied by fixed point laser reflection method.
结果表明：加工以后使应力重新分布和使残余应力降低或均匀化，冷热循环去应力处理效果很小。
The results indicated that after machining the stress is re arranged and the residual stress decreases; the effect of thermal cycle stress relief treatment is little.
测试了热循环前后胶接试样的拉伸剪切性能、质损率和表面残余应力，观察了拉伸剪切断口形貌。
The tensile shear properties, mass loss ratio and surface residual stress of the bond samples before and after the thermal cycling were measured. The tensile shear fracture morphologies were observed.
采用焊接热模拟试验方法研究了在焊接热循环和应力-应变循环同时作用下，2090铝锂合金焊接热影响区显微组织和力学性能的变化特征。
The variation of microstructure and mechanical properties of the welding heat-affected zone of 2090 Al-Li alloy were investigated by means of the welding thermal, simulated and strain cycles test.
试验包括热循环、应力循环和应力热循环等。
Experiments carried out include thermal, stress and stress-thermal cyclings.
随着冷热循环温度区间温差的增大、冷端温度的降低、循环次数的增多，形成的热应力对材料的界面损伤越严重；
The interfacial failure due to thermal stress will increase with increasing the range of temperature and the number of cycles.
随着冷热循环温度区间温差的增大、冷端温度的降低、循环次数的增多，形成的热应力对材料的界面损伤越严重；
The interfacial failure due to thermal stress will increase with increasing the range of temperature and the number of cycles.
应用推荐