热固性树脂基复合材料固化成型过程中产生孔隙的最简单机理是与挥发物的蒸气压相关联的。
A simple theory for void formation in the thermoset composite materials is presented to volatile vapor pressure.
热固性树脂基复合材料固化成型过程中产生孔隙的最简单机理是与挥发物的蒸气压相关联的。
A simple theory for void formation in the thermoset composite materials is presented to volatile vapor pressure.
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