单晶硅的激光铣削试验研究。

Experimental study of laser milling of silicon wafer.

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分析了工艺参数对铣削量和铣削质量的影响，并利用优化或复合的工艺对硬质合金试样进行多样激光铣削。

The effects of parameters on the amount and quality of laser milling were discussed. Moreover, various laser millings on horniness alloy were realized by the use of the optimized or composite arts.

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集团核心业务领域覆盖全面，包括“车削”、“铣削”、“超声振动加工”、“激光加工技术”及为机床和太阳跟踪系统而设计的自动化与软件解决方案。

The core business areas of "Turning", "Milling", "Ultrasonic" and "Laser" are complemented by automation and software solutions for machine tools and solar tracking systems.

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集团核心业务领域覆盖全面，包括“车削”、“铣削”、“超声振动加工”、“激光加工技术”及为机床和太阳跟踪系统而设计的自动化与软件解决方案。

The core business areas of "Turning", "Milling", "Ultrasonic" and "Laser" are complemented by automation and software solutions for machine tools and solar tracking systems.

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