概述了综合运用薄膜线路技术、喷墨打印技术和激光钻孔技术以及采用常规技术制作LTCC基板的简要工艺。
Technics of LTCC MLB processing using thin film circuit technology, ink-jet printing, laser drilling, and conventional manufacturing methods is introduced.
激光束的强度极高，这就使它成为一种方便的钻孔工具。
The high intensity of a laser beam makes it a convenient drill.
在生产领域，激光可以用来钻孔、切割、连接、硬化以及进行表面改性和微加工。
In the area of manufacturing, lasers are used for drilling, cutting, joining, hardening, surface modification and micromachining.
在生产领域，激光可以用来钻孔、切割、连接、硬化以及进行表面改性和微加工。
In the area of manufacturing, lasers are used for drilling, cutting, joining, hardening, surface modification and micromachining.
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