介绍一种基于串口通信，激光封装MEMS芯片的远程控制应用方案。
Based on serial port communication, a sort of long-distance control applications of MEMS packaging by laser was introduced.
目前，国内利用激光封装MEMS芯片的研究非常少，在我们课题中提出了MEMS芯片激光封装技术的研究。
At present, the research of MEMS encapsulation using laser is few at home. And the research of MEMS encapsulation using laser was brought forward in this thesis.
第一阶段将制造出具有200毫瓦平均功率同时具有4%插接效率的热电制冷激光器，并将其封装为1瓦的模块。
Phase I calls for making a 200 mW average power, thermoelectrically cooled laser with at least 4 percent wall-plug efficiency (WPE), and planning for combining those into a 1-watt module.
对于半导体封装的表面标识，激光打标是喷墨标记最主要的替代方法。
Laser marking is one of the major alternatives for marking semiconductor packages aside from ink-based marking.
激光软钎焊技术在微电子焊接和封装方面具有重要的应用价值。
Laser soldering technology has been found an important application in micro-electronic joining and packaging.
介绍了激光重熔在面阵列封装钎料凸点成形中的研究进展，并且对PBGA共晶钎料球激光重熔进行了工艺研究。
Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.
利用统计分析手段，对高功率二极管激光器封装中各工艺环节引起器件失效的原因进行了分析和归类。
Using statistics analysis method, diode laser failure states were classified and the causes of these diode laser failures were analyzed in every packaging process.
报道了一种新型塑料封装隧道结脉冲半导体激光器。
A new kind of pulse laser on tunnel junction with plastic package is reported.
介绍小封装光模块进行热插拔的技术难点及其解决方法和具体实现，主要包括热插拔时激光器的安全、热插拔时浪涌电流的抑制以及热插拔对系统总线干扰等问题。
The difficulty and the method of implement pluggable technology will be introduced including the safety of laser, the surge current of plug and the safety of system bus.
该模拟结果对大功率半导体激光器阵列的封装设计具有现实的指导意义。
The simulation results can guide the packaging of the high power semiconductor laser array.
本文研究了一种用于去除封装材料的数控精密激光切割技术。
The paper puts forward a kin of numerical controlled laser cutting technique applied to wipe off encapsulation of chip.
介绍了在集成电路制造封装中采用的激光微调、激光打孔、激光清洗、激光柔性布线和激光微焊技术。
Research progresses of laser trimming, laser drilling, laser cleaning, laser flexible routing and laser micro welding applied in the IC fabrication and packaging are given.
研究的激光融除工艺能够使所选择的COF叠层区域有效融除，而对封装的MEMS器件影响最小。
A laser ablation process has been developed which enables selected areas of the COF overlay to be efficiently ablated with minimal impact to the packaged MEMS devices.
垂直腔表面发射激光器，因其可自由排列和密集封装而特别引人注目。
Specially, a vertical cavity surface-emitting semiconductor laser is attractive, because of free arrangement and dense packing.
通过分析，对微通道热沉材料、冷却液、微通道热沉的结构参数以及热沉与激光器列阵条的封装等进行了优化设计。
Based on the analysis, the heat sink materials, cooling liquid, the heatsink structure, and the bonding of laser bar are optimized in order to increase the transfer efficiency.
同时封装了连续40W线阵二极管激光器。
At the same time, the CW 40w diode laser is successfully packaged.
重庆师范学院应用物理研究室已经用自己的工艺制造出高功率激光二极管线阵的微沟道冷却封装组件。
With the own art, the Modular Microchannel Cooler(MCC) have been made in the Applied Physics Laboratory of Chongqing Teacher's College. The MCC used to pack and to cool the laser diode bar.
通过激光微焊接机理的研究，得出脉冲激光更适合MEMS芯片的焊接封装。
The mechanism of laser jointing was studied, and the conclusion that impulse laser is even more the same with MEMS encapsulation was duced.
这种元件采用密封封装，与光纤加固在一起，然后再测试激光器的性能。
The components are enclosed in a hermetically sealed package, the fibers are spliced together, then the DPSS laser is tested for performance.
在众多的改进工艺中，运用激光实现键合是颇具特色的一项工作，目前也是激光在封装研究领域的热点之一，特别值得关注的一个方向是激光键合在生物mems领域中的应用。
Among numerous betterment technics, applying laser for bonding is a characteristic work, also is one of pop encapsulation researches, in which should pay more attention to application in biology MEMS.
一种自动激光功率控制电路，包括：激光二极管封装件，电压调节单元和极性调节单元。
An automatic laser power control circuit comprises a laser diode package, a voltage adjusting unit and a polarity adjusting unit.
摘要：针对分布反馈式(DFB)光纤激光器用于水声探测时频响曲线起伏较大的问题，设计了一种开孔套管式封装结构。
Abstract: To reduce the fluctuation of frequency response of a Distributed Feedback (DFB) fiber laser used in underwater sound detection, an encapsulated structure with orifices was designed.
耦合金属封装件是一整体管结构，或由激光器固定管体、耦合过渡管、以及外封管组成。
The coupling metal packaging piece is of an integral tube structure, or formed by a laser fixing tube body, a coupling transition tube and an outer packaging tube.
激光二极管封装件中包括的监视二极管能兼容使用，而不管其接地类型。
The automatic laser power control circuit provides an advantage that a monitor diode included in the laser diode package can be compatibly used regardless of its ground type.
激光二极管封装件中包括的监视二极管能兼容使用，而不管其接地类型。
The automatic laser power control circuit provides an advantage that a monitor diode included in the laser diode package can be compatibly used regardless of its ground type.
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