为了满足上诉移动通讯产品的苛刻要求，大量的新兴电子封装技术和封装产品应运而生。
Many new packaging technologies and package types are developed to meet these stringent requirements of mobile communication.
为了满足上诉移动通讯产品的苛刻要求，大量的新兴电子封装技术和封装产品应运而生。
Many new packaging technologies and package types are developed to meet these stringent requirements of mobile communication.
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