温度越高及焊锡表面的搅流越大，形成的浮渣越多。

The higher the temperature is, the bigger the stirring flow of the solder surface is, the more the scum there will be.

youdao

温度越高及焊锡表面的搅流越大，形成的浮渣越多。

The higher the temperature is, the bigger the stirring flow of the solder surface is, the more the scum there will be.

youdao