MMIC在片测试探头是MMIC在片测试系统的关键部件。
MMIC on-wafer probe is the key part of MMIC on-wafer measurement system.
由钨和镍制成的测试探头适合于联接并能机械破坏铝的氧化进行接触。
The test probes made of tungsten or nickel are suitable for making contact with mechanical breaking of aluminum oxide.
卫星射频测试探头允许直接测量lnb输出或卫星接收器或有线电视。
The RF satellite test probe allows direct measurement at the LNB output or at the satellite receiver or cable TV.
下一代的大规模集成电路的测试探头要求使用在铝电极上的低接触力的联接方法。
The contact method with low contact force on Al electrodes is required for test probing of LSI for the next generation.
下一代的大规模集成电路的测试探头要求使用在铝电极上的低接触力的联接方法。
The contact method with low contact force on Al electrodes is required for test probing of LSI for the next generation.
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