螺旋的疏密、大小与相对沉积速度有关。
The density and size of whorls are related to sedimentation rate.
对三价铬电解液镀铬的沉积速度进行了实验研究。
The chromium deposition velocity of trivalent chromium electroplating was researched.
沉积速度：单位时间内零件表面沉积出金属的厚度。
Sedimentary speed: unit time parts deposition on the surface of the metal thickness.
首先讨论在水平流动时的最低速度，即沉积速度。
We first consider this minimum velocity for horizontal flow, the saltation velocity.
该工艺操作简单，工艺范围宽，电流效率高，沉积速度快。
The process features simple operation, wide operating range, high current efficiency and fast deposition speed.
研究了电流密度与沉积速度、晶粒尺寸及镀层硬度的关系。
The relationships of current density with deposition rate, crystal size and hardness of deposit were studied.
研究了操作条件对沉积速度的影响，确定了最佳工艺条件。
The effects of operation conditions on the rate of deposition are studied and the optimum plating process is defined.
离化率高，膜层反应充分，使膜层颜色纯正，沉积速度快。
High ionization rate, full reaction, pure film color, fast deposition.
详细讨论了化学镀镍工艺参数对沉积速度和镀层质量的影响。
The effect of chemical nickel plating parameters on deposition speed and plating quality is discussed.
同时还讨论了反应温度和氯化物浓度对金属沉积速度的影响。
The effects of reaction temperature and chloride concentration on the deposition rate of metal are also discussed.
这些变化都加快了电沉积速度，使高速局部电镀有可能实现。
All these changes enhance electrodeposition rates, thus high-speed selective electroplating can be reached.
实验结果表明，碳化硅颗粒的沉积速度高于石油焦的沉积速度；
The results showed that silicon carbide and petroleum coke powder co-deposited homogeneously;
温度升高，沉积速度加快，因此，应当避免热量散失到周围环境中。
Increase in temperature increases the rate of deposition and hence the heat loss to the surroundings should be prevented.
研究了稀土元素铈、镧、钇对化学镀钴-镍-硼合金沉积速度的影响。
The effect of rare earth elements such as cerium, lanthanum and yttrium on electroless deposition rate of cobalt-nickel-boron alloy was studied.
结果：热有机膜处理后的镁合金，其羟基磷灰石的沉积速度和结晶度都优于碱热法。
Results: The deposition rate and crystallinity of HA treated by the heat-organic layers treatment were better than those by alkali-heat treatment.
电流密度低，沉积速度慢，容易出现阴阳面，光泽欠佳；电流密度过高，凸部易烧焦。
Current density low, sedimentary speed is slow, prone to Yin and Yang, the luster of the poor, face Current density too high, convex department easily burnt.
重点研究了渗透压对化学镀共沉积钯银的沉积速度、镀层组成和膜表面结构性能的影响。
More attention was focused on the effects of osmosis on the deposition speed, compositions, surface structure properties of the simultaneously deposited Pd-Ag alloy top layer by electroless plating.
CVI（ 化学气相浸渗）反应器内气体的输运对基体的沉积速度与沉积质量有重要的影响。
The effect of fluid flow in the CVI reactors on the deposition velocity and quality is of great importance.
通过一定的实验观察，对影响沉积速度的因素进行了初步分析，并对若干关联式加以评述讨论。
Through certain experimental observations, the factors of influence on the saltation velocity and some correlations are reviewed and discussed.
它具有沉积速度快和表面清洁的特点，特别具有膜层附着力强、绕射性好、可镀材料广泛等优点。
It has a fast deposition rate and surface cleaning features, in particular strong adhesion with the film, diffraction, and can be coated material widely and so on.
一般情况下，凹陷沉积速度越大，所堆积的沉积岩体积及有机质含量就越大、油气资源也愈多。
Generally, higher sedimentation velocity means larger volume of deposits, higher content of organic content, and more hydrocarbon resources.
机械镀锌工艺中起关键作用的是锌粉团在工件上的吸附、强化和稳定这一过程可以提高沉积速度。
Adsorption of zinc powders on surface of work pieces playes an important part in the process of mechanical plating, the strengthening and stabilizing adsorptions can increase the speed of deposition.
分析了敏化活化一步法的优点，讨论了工艺条件对镀层结合力、镀层外观以及镍的沉积速度的影响。
The advantages of the above process were analyzed, and the influences of the process conditions on the deposit adhesion, appearance and deposition rate were discussed.
研究了酸性化学镀镍溶液中加速剂对沉积速度、氢的析出量、镀层含磷量和镀层耐腐蚀性能的影响。
Effect of the speeding additive on deposition rate, hydrogen evolution amount, content of phosphorus and corrosion resistance of deposit in acidic electrolyte has been studied.
对镀层外观、沉积速度及镀液分散能力与覆盖能力进行了测试，并与国外某知名品牌的工艺进行了比较。
The deposit appearance, deposition rate, throwing power and covering power of the process were tested and compared with those of one overseas known kindred process.
另一方面，置换镀铜作为铁粉表面改性方法，工艺简单，沉积速度快，成本低，工艺流程中环境污染小。
On the other hand, as iron powder surface modification method, the copperized replacement technics is simple, low cost, fast sediment speed and has little environmental pollution.
硫酸盐光亮镀锡工艺具有电流效率高、沉积速度快、成本低及废水易处理等优点，在电镀生产中已广泛应用。
Sulfate tin plating process has been widely used in electroplating industry for its strengths such as high current efficiency, fast plating rate, low cost and easy effluent disposal.
为进一步提高沉积速度，对灯丝组施加相对于基底夹持器的负偏压，使得在基底和灯丝组之间的DC等离子体也得以保持。
To further increase deposition rates, the filament array is biased negatively with respect to the substrate holder so that a DC plasma is also maintained between the substrate and filament array.
ATSADDCOPPERCT系列中沉积速度快，结合力最强的产品，刚挠性基板应用中优先推荐的化学镀铜溶液。
Ct Series ATS ADDCOPPER deposition speed, the strongest combination of product, just flexible substrates recommend priority application of chemical copper plating solution.
脉冲电解可以调解电流密度、 电流的通断时间、脉冲频率等多个参数，为控制金属沉积层的质量和沉积速度提供了有力的手段。
Many parameters, such as current density, time on and off, pulse frequence, can be interceded in pulse electrolysis. This offers a powerful means to control quality of layer and aggradation speed.
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