结论银汞合金充填体中释放的汞量较少。
Conclusion The amount of mercury released from amalgams is small.
树脂粘结剂对银汞合金充填微渗漏的影响。
Study of the microleakage on bonding resin for amalgam filling.
目的研究粘结技术对银汞合金充填体边缘微漏的影响。
Objective to study influence of bonded technique on marginal microleakage of amalgam restoration.
目的研究树脂粘结技术对银汞合金充填时微渗漏的影响。
Objective To study the microleakage of amalgam filling with bonding resin.
结论采用粘结技术可以明显减少银汞合金充填体的边缘微漏。
Conclusion Bonded technique can distinctly reduce marginal microleakage of amalgam restoration.
前言：目的：对窝沟封闭剂作为银汞合金充填的粘结剂进行实验研究。
Objective: To evaluate the effect of pit and fissure sealant as dental adhesive for silver amalgam.
在Dycal 完全凝固后，如用银汞合金充填，需要涂布洞衬剂后再进行充填。
After the DYCAL? has completely set, use cavity varnish under amalgam restorations.
方法用冷原子吸收光谱法测定16名实验对象银汞合金充填前和充填后各时间点唾液汞量，用SAS软件程序进行分析统计。
Methods The level of S-Hg of 16 specimens on each time-point before or after amalgams filling were tested by means of absorbed spectrometry, and analysed by SAS program.
结果发汞在银汞合金充填后1天、1周、2周与基线值很接近，第4周、第8周则有所上升，而1年后发汞与基线值又很接近。
Results The level of H-Hg on 1st day, 1st week, 2nd week after amalgams filled was very close to baseline, but elevated slightly on 4th and 8th week, and on 1st year close to baseline again.
目的：对EM粘结剂银汞合金粘结充填进行实验及临床应用研究。
Objective:To perform experiment and clinical study of EM dental adhesive for silver amalgam restortions.
传统的修补材料有氢氧化钙、银汞合金等，直接用于穿孔的充填。
Conventional material such as calcium hydroxide, amalgam have been used for repairing this perforation.
结果镓合金组根尖充填后2 8天时的微渗漏情况明显优于GK高铜银汞合金组，差异有显著性意义（P< 0 .0 1 ）。
Results There was a statistically significant difference of microleakage between the Gallium Alloy and GK High Copper Amalgam group after 28 days' immersion in 1% Methylene Blue solution (P<0.01).
结果镓合金组根尖充填后2 8天时的微渗漏情况明显优于GK高铜银汞合金组，差异有显著性意义（P< 0 .0 1 ）。
Results There was a statistically significant difference of microleakage between the Gallium Alloy and GK High Copper Amalgam group after 28 days' immersion in 1% Methylene Blue solution (P<0.01).
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