• 氮化镓试图进入市场600v

    GaN is also trying to enter the 600v market.

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  • 其中两个四大商业氮化镓公司

    Two of them are in the top four commercial GaN companies.

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  • 目前市面多数白色发光二极管都是基于氮化的.

    Most of the white LEDs now on the market are based on gallium nitride.

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  • 目前氮化镓器件大多数制作蓝宝石上。

    At present, Most of GaN-based devices are fabricated on sapphire.

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  • 氮化一种用来生产亮蓝色LED半导体

    Gallium nitride is a semiconductor used to create bright-blue LEDs.

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  • 研究者概念验证实验使用半导体材料氮化镓

    The researchers used a gallium nitride semiconductor in the "proof of concept" tests.

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  • 基于蓝宝石氮化发光二极管一般量子效率为70%。

    A gallium nitride LED on sapphire has a typical internal quantum efficiency of around 70%.

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  • 阐述生长中使用蓝宝石晶重要性

    The significance of sapphire wafer cleaning in growing of GaN is explained.

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  • 氮化镓给予作战人员战场上更大机动性效能可靠性

    GaN will also give the warfighter significantly more mobility, capability and reliability on the battlefield.

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  • 这样等离子干法蚀刻氮化镓电气性能损伤有显著降低。

    The plasma dry etching method is of evidently-reduced damage to the electrical performance of the allium nitride.

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  • 美国雷声公司正在未来雷达升级开发一种基于氮化的发射-接收模块

    April 16, 2008...Raytheon of Tewksbury, Massachusetts USA, is developing gallium nitride-based transmit-receive modules for use in future radar upgrades.

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  • 真正竞争不是化镓世行集团之间现任硅基技术

    The real competition is not between GaN and SiC, but WBG versus incumbent silicon-based technology.

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  • 雷声公司正在演示使用氮化镓微波集成电路放大器的发射-接收模块

    Raytheon says it is demonstrating that transmit-receive modules using GaN-powered monolithic microwave integrated circuit amplifiers (MMICs).

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  • 即使目前的早期阶段认为基的氮化发光二极管已经具有商业意义了。

    Yet even at this early stage he thinks gallium nitride-on silicon LEDs would make commercial sense.

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  • 氮化镓技术提供更高可靠性效率从而降低功耗总量,放宽冷却要求

    GaN technology provides increased reliability and efficiency, resulting in lower prime power consumption and relaxed cooling requirements.

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  • 发现生成p氮化镓的时候需要利用高温,以致于把氢原子引入了晶体之中。

    He found that producing p-type gallium nitride, which made use of ammonia at high temperatures, trapped hydrogen atoms inside the crystal.

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  • 最终被发现很难做到没有瑕疵即使n型氮化镓很容易造出p型却不然。

    Gallium nitride turned out to be difficult to grow without defects, and although n-type gallium nitride could be made easily, p-type could not.

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  • 目前LED片的制作设备类似,都通过蓝宝石衬底片上沉淀氮化镓实现。

    At present these LEDs are made in machines similar to those used to make silicon chips, by depositing layers of gallium nitride on sapphire-based wafers.

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  • 通过金属有机物气相沉积方法纳米模板生长氮化镓纳米线束。

    Template growth of gallium nitride nanowires was demonstrated by metal organic chemical vapor deposition (MOCVD) with carbon nanotubes as templates in this paper.

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  • 发明公开了种在衬底上生长氮化镓薄膜方法包括如下步骤选择硅衬底;

    The invention discloses a method for growing a gallium nitride membrane on a silicon substrate, which comprises the following steps: selecting the silicon substrate;

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  • 氮化镓晶体管已经取得了他们方式进入低电压应用发现难以望其项背。

    GaN transistors have made their way into low-voltage applications, which SiC will find difficult to challenge.

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  • 方法避免降温过程应力造成晶片破裂问题尤其适于化镓氮化衬底制备

    The method avoids the problem that the wafer break is caused by thermal stress in the course of cooling down, especially is suitable for preparing gallium nitride and aluminum nitride substrates.

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  • 20世纪80年代后叶akasaki同事们名古屋大学通过添加少许制造首例p型氮化

    In the late 1980s Isamu Akasaki and his colleagues at Nagoya University created the first p-type gallium nitride by incorporating tiny amounts of magnesium.

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  • XRD、SEMTEMHRTEM纳米结构表面形貌和微结构进行了分析研究。

    The XRD, SEM, TEM, and HRTEM are employed to analyze the morphology and structures of GaN nanostructures.

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  • 近年来,氮化镓led发光效率很大的进展,不过静电防护上却还有很大的改善空间。

    In recent years, there is a large improvement on the luminous efficiency of LEDs. However, there are some problems in LED ESD protection.

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  • 化镓增长等离子体辅助(111)分子束外延(001)衬底上氮化缓冲使用

    Gallium nitride is grown by plasma-assisted molecular-beam epitaxy on (111) and (001) silicon substrates using hafnium nitride buffer layers.

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  • 化镓增长等离子体辅助(111)分子束外延(001)衬底上氮化缓冲使用

    Gallium nitride is grown by plasma-assisted molecular-beam epitaxy on (111) and (001) silicon substrates using hafnium nitride buffer layers.

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