所述基板背对所述镜头模组的表面上设置有至少一个外接点，所述外接点与所述金属接点相接触。
The surface of the substrate, which is opposite to the camera module, is provided with at least one external contact, and the external contact is contacted with the metal contact.
所述相机组件包括所述电路板和一个相机模组，所述相机模组包括一个镜头模组、一个影像感测器和一个基板。
The camera component comprises the circuit board and a camera module, wherein the camera module comprises a lens module, an image sensor and a substrate.
所述影像感测器与所述基板电性连接，且收容在所述镜头模组内。
The image sensor is electrically connected with the substrate, and is accommodated in the lens module.
本发明所提供的热发声模组，其热发声膜由所述基板与盖板封装固定，如此形成一具热发声膜的完整的模组结构。
The thermal sounding film of the thermal sounding module is sealed and fixed by the base plate and the cover plate, and thus, a complete module structure with the thermal sounding film is formed.
成像模组具有一基板和一固定在基板上的镜头。
The imaging module is equipped with a substrate and a lens fixed on the substrate.
成像模组具有一基板和一固定在基板上的镜头。
The imaging module is equipped with a substrate and a lens fixed on the substrate.
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