结果显示，采用有机保护层的焊接界面金属间化合物层厚度明显超过了浸银层；

The thickness of intermetallic compounds (IMC) layer with OSP was higher than that of I-Ag.

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结果显示，采用有机保护层的焊接界面金属间化合物层厚度明显超过了浸银层；

The thickness of intermetallic compounds (IMC) layer with OSP was higher than that of I-Ag.

youdao