电路结构简单、工艺兼容性好，同时具有温度的迟滞特性可以更好的保护芯片，避免热振荡的产生。
It features simple structure, good process compatibility and function of temperature hysteresis which prevents the damage by thermal-oscillation.
电路结构简单、工艺兼容性好，同时具有温度的迟滞特性可以更好的保护芯片，避免热振荡的产生。
It features simple structure, good process compatibility and function of temperature hysteresis which prevents the damage by thermal-oscillation.
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