在所有半固态镁合金试验中，水淬试样的晶粒密度都大于重力铸造的金属型试样的晶粒密度。这表明在半固态成型过程中，晶粒有很强的长大合并的趋势。
The density of the quenchinching samples was higher than that of the metal-mould ones and the grains were much easier to grow and merge in the shaping of the semi-solid alloys.
随着电流密度的增加﹐阴极极化作用随着增加﹐镀层晶粒越来越细。
Along with the increase of the current density, cathode polarization effect, coating grain with increasing more and fine.
结果表明，随着电流密度的增加，电沉积的锡晶粒度逐渐细化，合金层的晶粒度有变粗的趋势。
The results show that the grain size of tin gradually gets smaller while that of alloy layer gets bigger and bigger with the increasing of current density.
针对先进纳米铜互连技术的要求，研究了脉冲电流密度对铜互连线电阻率、晶粒尺寸和表面粗糙度等性能的影响。
Aiming at the technology demand of advanced copper interconnection, the effect of pulse current density on cu layer properties such as resistance, crystal size and surface roughness were investigated.
研究了电流密度与沉积速度、晶粒尺寸及镀层硬度的关系。
The relationships of current density with deposition rate, crystal size and hardness of deposit were studied.
研究分析表明，晶粒细化、高的马氏体含量、马氏体高位错密度和固溶含碳量是获得超高硬度的主要原因。
We assume that the ultrahigh hardness is mainly due to the ultrafine grains, high density dislocation and more content of carbon in martensite.
再结晶晶粒的生长速度与再结晶驱动力成正比，再结晶驱动力取决于晶界能和位错密度。
The growth velocity for recrystallized grain is proportional to the driving force of recrystallization, which is determined by the grain boundary energy and dislocation density.
外加磁场改变了渗碳体片层的分叉形成过程，随磁通密度的增加，珠光体晶粒内部的渗碳体片层趋向于平行排列。
The bifurcation process of cementite flake is changed by magnetic field. The cementite flakes in pearlite grains tend to be parallel with the increase of magnetic flux density.
结果表明，魏氏组织针由多个块状的亚晶粒组成，亚晶粒边界由位错缠结而成，在亚晶粒内有较高的位错密度；
The results show that Widmansttten structure needle consists of many blocky subgrains that have higher dislocation density and subgrain boundary is made up of dislocation tangle.
退火后薄膜中的晶粒尺寸和密度都有所提高，退火温度升高或退火时间延长都有助于结晶状态的改善。
High anneal temperature and long anneal time do good on increasing the size and density of silicon nano-crystals.
结果表明，初始钨粉粒径越小，制备得到钨块的密度越小，晶粒平均直径也越小；
The results show that the smaller the particle size of tungsten powders, the lower the density and the smaller the grain size of the sintered tungsten block.
适当的升降温制度能起到提高电极致密度、细化电极晶粒的效果。
Appropriate heating and cooling system can improve the density, refine grain.
研究了烧结坯的密度、抗弯强度、晶粒度与掺碳量、烧结温度、保温时间的关系。
The relationships between the density, bending strength and grain size of the sintered compact and the quantity of additives, sintering temperature, sintering time were investigated .
高能球磨试样晶粒生长速率和致密度升高速率比等离子蒸发试样的快。
Moreover, it was found that grain size and relative density growth rate of milling sample were higher than those that prepared by plasma evaporation method.
结果表明：随着变形温度的升高和应变速率的减小，位错密度减小，亚晶粒尺寸增大；
The results show that the dislocation density decreases and the subgrain sizes increase with the increase of deformation temperature and the decrease of the strain rate;
结果表明挤压一次后，晶粒内位错密度急剧增加，形成位错纠缠，晶粒细化效果最明显；
The results show that grain size is significantly refined due to the sharply increases of dislocation density in grain resulting in dislocation tangle after one-turn pressing.
介绍了SPS技术在制备纳米材料、梯度功能材料和高致密度、细晶粒陶瓷等方面的研究和应用。
Some applications of the SPS process, particularly in the fabrication of nano-materials, the functional gradient materials and the high-density fine-grain ceramics are reviewed.
结果表明：随着烧结温度的升高和保温时间的延长，气孔率和吸水率减小，体积密度和弯曲强度升高；晶粒长大填充气孔，使多孔材料孔隙率下降而强度增加。
The results show that the porosity and water absorption decrease and the bulk density and bending strength increase, along with the sintering temperature raising and the time prolonging.
同时，随烧结密度的提高，晶粒尺寸的分布变宽。
Also, the distribution of grain size tends to widen with the density of the sintered product.
极限电流密度的增大使阴极过电位增大，从而提高合金的形核速率，使沉积层晶粒的尺寸减小、显微硬度升高。
At the same time, the increase of over-potential results in the nucleating rate and the micro-hardness of deposits increasing, while the grain size deposits decreasing.
阐述了电流密度、电流波形、有机添加剂等工艺参数对沉积层晶粒尺寸的影响；
The effects of parameters such as current density, current waveform and organic additives on grain size of deposition layer are described.
硅基薄膜的红光发射与纳米晶硅密度及波尔半径内晶粒数目有着密切的关系。
The red emission of Si-base films is related to the density of the nanometer grains and the number of the grains in the Bohr radius.
同时，随烧结密度的提高，晶粒尺寸的分布变宽。
Also, the distribution of grain size tends to widen with the density of th...
但是晶粒尺寸增大后晶界处因局部腐蚀电流密度增大将会在局部造成更深的腐蚀坑槽并降低耐候性；
The total quantity of corrosion surface defect is decreased due to the decrease of grain boundary energy with the increase of grain size and the atmospheric corrosion resistance is increased.
但是晶粒尺寸增大后晶界处因局部腐蚀电流密度增大将会在局部造成更深的腐蚀坑槽并降低耐候性；
The total quantity of corrosion surface defect is decreased due to the decrease of grain boundary energy with the increase of grain size and the atmospheric corrosion resistance is increased.
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