从2000年开始，硅晶片直径的行业标准达到 300毫米（直径大约一英尺）。
Since 2000, the industry standard has been 300 mm [about a foot in diameter].
公司还认为，2007年3英寸和4英寸的材料将占到砷化镓晶片产量的70%，大直径材料市场到2012年将不断增长。
The company said that three - and four-inch material accounted for 70 percent of the GaAs wafer output in 2007 and the market for larger diameter material will continue through 2012.
该系统可以处理直径多达200毫米的晶片，包括模具的倒装。
The system can process wafers up to 200mm in diameter and includes die inversion for flip chip applications.
该系统可以处理直径多达200毫米的晶片，包括模具的倒装。
The system can process wafers up to 200mm in diameter and includes die inversion for flip chip applications.
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