概述了现代特大规模集成电路对硅单晶片的质量要求、直拉硅单晶生长工艺及晶片加工技术研究进展和硅单晶材料市场现状及发展趋势。
The quality requirements on si wafer for modern ULSI, research progress on CZ si crystal growth technology and wafer processing, the market situation and prospect were outlined.
晶片等离子体加工室的结构设置成使反应性自由基与放置在晶片等离子体加工室内的晶片表面上的物质反应。
The wafer plasma processing chamber is configured to react the reactive radical with a species at a surface of a wafer disposed in the wafer plasma processing chamber.
介绍了微电子机械系统的四种基本制作技术，即本体微机械加工、表面微机械加工、铸模工艺和晶片键合工艺。
Four fundamental manufacturing technologies namely bulk micromachining, surface micromachining, moulding and wefar bonding are introduced for Micro Electro Mechanical System(MEMS).
双面抛光已成为硅晶片的主要后续加工方法，但由于需要严格的加工条件，很难获得理想的超光滑表面。
Double sided polishing process has become a main machining method for silicon wafer finishing process, but it is difficult to get ultra-smooth surface with the very stringent machining conditions.
石英晶片电参数决定了其产品质量优劣，因此在石英晶片生产加工过程中精确测试其电参数尤为重要。
Quality of quartz crystal wafer is determined by its electrical parameters, so it is of great importance to measure its parameters accurately in the process of manufacture.
生物芯片是现代微加工技术和生物技术的结晶是具有一定生物功能的微晶片结构。
Biochip is a modern technology of micro-fabrication coupled with modern biotechnology. It is a microchip structure with specific biological functions.
同时研制了数控液流悬浮抛光机床，并对硅晶片等材料进行了加工试验。
At the same time aerosol developed the numerical control liquid flow to polish the engine bed, and to material and so on silicon chip has carried on the processing experiment.
该方法包括通过安装晶片并在晶片内加工沟槽，来准备结晶或多晶晶片。
The method comprises preparing the crystalline or polycrystalline wafers by mounting them and machining trenches into the wafers.
双面抛光已成为硅晶片的主要后续加工方法，但由于需要严格的加工条件，很难获得理想的超光滑表面。
The wafer motion and the load in double-sided polishing process are main factors which affect the wafer surface quality.
Centura机器右侧的银色金属设备是一个斗式装载机（batch loader），用于快速给一叠硅晶片降压，然后将它们输送至Centura机器中加工。
The silver metal device on the right side of this Centura machine is a batch loader, used to quickly depressurize a stack of wafers prior to feeding them into the machine for processing.
Centura机器右侧的银色金属设备是一个斗式装载机（batch loader），用于快速给一叠硅晶片降压，然后将它们输送至Centura机器中加工。
The silver metal device on the right side of this Centura machine is a batch loader, used to quickly depressurize a stack of wafers prior to feeding them into the machine for processing.
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