Jiro Kajiwara：晶片传送装置和晶片研磨装置，以及晶片的制造方法。
Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer.
其上放置晶片的传送臂的表面具有在扇形区域中多个以等间距形成的抽吸孔。
A surface of the transporting arm on which a wafer is placed is provided with a plurality of suction holes formed at equal intervals in a fan-shaped region.
晶片通过抽吸孔固定到传送臂。
The wafer is fixed to the transporting arm through the suction holes.
晶片通过抽吸孔固定到传送臂。
The wafer is fixed to the transporting arm through the suction holes.
应用推荐