随着降低回火温度，微观应变升高而晶块尺寸减小。
The microstrains increase and domain sizes decrease with the decrease in tempering temperatures.
该工艺不受人造聚晶金刚石外形及尺寸的限制，可对拉丝模中的人造金刚石聚晶块提供有效的紧固保护。
This technique is no longer restricted by the formal regularity of diamond polycrystal blank, and can give an effective tight protection to diamond polycrystal blank in wire-drawing die.
维氏硬度测试结果显示，出现在愈合区的铁素体组织维氏硬度高于基体区铁素体组织，可能原因是愈合区中出现的多边晶块结构所引发的强化。
Vickers hardness test showed that the hardness of ferrite in healing area is higher than that in matrix, which may result from the strengthening of polyangular grains.
硅晶片通常都是从一块较大的硅上裁剪而来，此方式浪费了大概一半的圆晶原料。
Normally silicon wafers are cut from a larger piece of silicon. This wastes about half of the wafer material.
例如，如果晶圆代工厂拿走了太大的一块蛋糕，价值链上的其它业者如芯片设计者将会很难生存。
If foundries, for instance, took a much larger piece of the pie, others in the value chain, such as chip designers, would find it hard to survive.
熔块完全融熔去除内部晶界之后，促进了取向性晶粒结晶。
Crystallization of the particles with preferred orientation was promoted, after the removal of internal interface through complete melting of the frit particles.
利用SEM和TEM等方法对晶须预制块和复合材料进行了微观组织结构分析。
Microstructures of the preform and the composite were analyzed under SEM and TEM.
低腐蚀隧道：为确保低腐蚀隧道密度，我们对晶种的腐蚀隧道密度进行逐块检测。
本实验显示经过最佳化的传输线路设计与凸块分布，低成本高效能的覆晶封装结构目标可以达成。
With optimized circuit design and bump layout, high performance transmission lines for flip chip packages can be achieved using dry film as the masking material for the bump plating.
为了简化运输和尽可能降低被污染的风险，芯片制造商利用“前开式标准晶圆盒”即所谓的FOUP来搬运晶圆。每个无尘超净的晶圆盒中可放置25块硅晶圆。
To simplify transportation and minimize the risk of contamination, fabs make use of "front-opening unified pods, " or FOUPs. Each one holds 25 wafers in a sterile, clean environment.
为了简化运输和尽可能降低被污染的风险，芯片制造商利用“前开式标准晶圆盒”即所谓的FOUP来搬运晶圆。每个无尘超净的晶圆盒中可放置25块硅晶圆。
To simplify transportation and minimize the risk of contamination, fabs make use of "front-opening unified pods, " or FOUPs. Each one holds 25 wafers in a sterile, clean environment.
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