晶圆处理系统是光刻机的重要组成子系统，其包含两个主要部分：晶圆传输系统和晶圆预对准系统。
The wafer processing system is an important subsystem of the lithography, which consists of a wafer transmission system and a wafer pre-alignment system.
从全自动划片机的工作机理出发，分析空气静压电主轴、晶圆传输定位、自动对准、自动清洗等全自动划片机的关键技术；
The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed.
主要研究内容是研制用于12英寸晶圆预对准的系统。
The main content of the research is to design and manufacture a system that is fit for 12-inch wafer pre-aligning.
主要研究内容是研制用于12英寸晶圆预对准的系统。
The main content of the research is to design and manufacture a system that is fit for 12-inch wafer pre-aligning.
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