ESD的问题不仅对于成品来说很重要，在制造过程中（从晶圆制程、封装到组装整个系统）也是很重要的课题。
ESD is an issue not only for finished products but also during their manufacture, from wafer fabrication to packaging to the assembly of complete systems.
新工厂将继续在300mm晶圆上利用65nm制程生产Cell处理器等。
The new company will continue producing semiconductors on a 300 mm wafer line and use a 65nm production process.
在现今新的晶圆中，每一个制程的参数上的改变，往往对最后的晶圆生产上的良率有重大的影响。
In the new age of process technology, production yield is eventually influenced by the parameters changed in process.
因此一旦我们有了足够大的石墨烯晶圆，那直接采用同样的制程步骤就可以了。
So once we have large wafers of graphene it should be straightforward to use the same process.
一串制程因子的实验设计，以晶圆薄膜厚度近九点量测。
A fairly large fractional factorial experiment on epi growth was performed, with spatial measurements of thickness and resistivity.
制程工具用以处理晶 圆；
制程工具用以处理晶 圆；
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