在无铅化进程中，由于无铅焊点焊料的不同和焊接工艺参数的调整，必然会给焊点可靠性带来许多新的影响。
In the process of lead-free, because of the difference of lead-free solders and adjustment of technical parameter, we will face many new problems of reliability.
在无铅化进程中，由于无铅焊点焊料的不同和焊接工艺参数的调整，必然会给焊点可靠性带来许多新的影响。
In the process of lead-free, because of the difference of lead-free solders and adjustment of technical parameter, we will face many new problems of reliability.
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