允许对校准块表面镀铬或无电镀镍。
It is permissible to chromium plate or electroless nickel plate the surfaces of the block.
还公开了涂布银金属用的自催化的无电镀覆浴。
An autocatalytic electroless plating bath for coating silver metal is also described.
采用无电镀沉积技术在经过机械抛光的单晶硅衬底上沉积了铜纳米晶。
Copper nanocrystallites were deposited on mechanically polished single crystal silicon (sc-Si) wafers by electroless deposition method.
因此，用钯导电体层形成溶液将工件转变成导体，所述溶液是中性的，不使用高碱性无电镀铜溶液。
Thus, the work is converted to a conductor with the solution for palladium conductor layer formation, which is neutral, without using an electroless copper plating solution which is highly alkaline.
在无电镀镍浴中因次磷酸根氧化而产生的亚磷酸根离子，可以通过碱金属或碱土金属阳离子如钙的沉淀作用而去除。
Orthophosphite ions produced by oxidation of hypophosphite in an electroless nickel plating bath can be removed by precipitation with an alkali metal or alkaline earth metal cation such as calcium.
因此，研究出合适的无氰镀铜工艺来取代氰化镀铜工艺一直是广大电镀工作者的目标。
So, to find a non-cyanide alkaline copper plating bath is a great target of the plating operator.
指出了当前电镀生产无氰化过程中存在的问题。
The current problems existing in the non-cyanide electroplating production were presented.
研究了脉冲电镀在微氰镀金，无氰镀金体系中脉冲频率、脉冲占空比对镀金层耐磨性的影响。
The effect of pulse frequency and pulse duration ratio on the abrasion resistance of gold coatings is investigated with pulse plating in cyanide free and trace cyanide baths.
应良好无秤锈、裂痕、电镀不良现象。
Appearance: the good parts should weigh no rust, cracks, electroplating ill.
我们拥有专利权的设置程序可以进行深腔镀膜，同时在无孔隙的情况下保持电镀厚度。
Our proprietary setup procedures enable us to plate in deep cavities, while maintaining electroform thickness with zero porosity.
要把这些电镀三废消化于电镀工艺过程中，从而达到自然封闭循环和无排放是不可能的事。
Therefore, it is impossible to consume these wastes in electroplating process and become natural closed cycle or non-discharge.
电镀分有氰电镀与无氰电镀两类。乡镇工业电镀行业的环境污染最主要是氰污染和铬污染。
The main pollutants from electroplating enterprises of township and village industries (TVIs) in China are cyanide and chromium.
主要产品有：焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。
The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.
通过添加辅助络合剂和控制起始电流密度的方法，可以增强无氰电镀时阴极的极化。
Through adding assistant complexing agent and controlling initial current density, cathodic polarization was intensified in cyanide-free electrolyte.
提供一种无电电镀系统。
还提供一种将无电电镀液施加至基板上的方法。
A method for applying an electroless plating solution to a substrate is also provided.
因此，电沉积无铅可焊性镀层是电子电镀领域的研究热点之一。
Therefore, electroplating of lead-free solder coating is one of investigation hotspots in electronic electroplating field.
批发采购电镀助剂-供应666无铅无镍光亮厚白铜锡（电镀助剂）批发…
The lead-free nickel free white and bright nickel substitute plating process…bright nickel substitute tin salt 30g 666 lead-free nickel free white and …
本文介绍了国内无氰镀银研究情况，部分翻译了日本专利特开2000-192279，介绍银及其合金的无氰电镀液组分及工艺，镀液比较稳定。
JP-2000 192279, Cyanide-free electroplating bath for silver and silver alloy coating, using fatty sulphurous compounds that are stable for a relatively long time.
武钢冷轧厂电镀锡线锡层厚度无模型自适应（FMA）控制系统是专门为了解决大滞后时变的非线性复杂系统控制难题而研制设计的。
Tin thickness closed-loop control for tinning line, a kind of typical non-linear complex system with large time delay, is discussed.
武钢冷轧厂电镀锡线锡层厚度无模型自适应（FMA）控制系统是专门为了解决大滞后时变的非线性复杂系统控制难题而研制设计的。
Tin thickness closed-loop control for tinning line, a kind of typical non-linear complex system with large time delay, is discussed.
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