冬旦寒惨澹，云日无晶辉。
现时只有一些大型公司及无晶圆设计公司内设有集成电路设计小组，但为数不多。
At present, only a small number of IC design teams can be found in certain big companies and in fabless design houses.
耐腐蚀性强，本产品化学镀镍处理后的表面是一种非晶态镀层，因无晶界，所以抗腐蚀性特别优良（见表一）。
Corrosion resistance, the surface treatment of the product is amorphous coating, without a grain boundary, so particular corrosion resistance(see Table 1).
且微粉化过程无结合溶剂损失及晶型转化发生。
No loss of combined solvent or crystal form transformation were observed during micronization.
结果发现，时效造成的沿晶析出及伴随产生的沉淀物无析出带是促使合金发生沿晶开裂的主要因素。
The results show that the precipitates on the grain boundaries and precipitate free zone (PFZ) were the main factor to enhance the intergranular crack of the alloy.
在液氮中快淬得到的单晶是无孪晶的。
The twin free crystals were obtained by quenching into liquid nitrogen.
在薄壁铸件中获得无游离渗碳体和铁素体基体的稀土球铁的关键是高碳过共晶原铁水。
Therefore, in thin section castings, for eliminating eutectic carbides and obtaining ferritic matrix, melts treated by re need high carbon content and hypereutectic composition.
采用无电镀沉积技术在经过机械抛光的单晶硅衬底上沉积了铜纳米晶。
Copper nanocrystallites were deposited on mechanically polished single crystal silicon (sc-Si) wafers by electroless deposition method.
研究了细晶无磁硬质合金金属注射成形工艺中碳含量的控制。
CarbonControl in MIM Process of Nonmagnetic Fine cemented Carbide was studied.
为了简化运输和尽可能降低被污染的风险，芯片制造商利用“前开式标准晶圆盒”即所谓的FOUP来搬运晶圆。每个无尘超净的晶圆盒中可放置25块硅晶圆。
To simplify transportation and minimize the risk of contamination, fabs make use of "front-opening unified pods, " or FOUPs. Each one holds 25 wafers in a sterile, clean environment.
采用普通干燥法制备得到的复合氧化物具有较低的孔体积和比表面积，颗粒间团聚较严重，但无“孤岛”状大颗粒，晶相为无定型结构。
But the CeO2-TiO2 mixed oxides prepared by conventional drying method show lower pore volume and surface area with serious aggregation, and amorphous phase compared to the corresponding aerogels.
又可称为晶圆电阻、圆柱型电阻、无引脚电阻、或无引线电阻，主要用于表面贴装加工过程。
RJM resistor MELF Resistors also can be called a wafer resistance, cylindrical-type resistance, non-pin resistance, or non-lead resistance, mainly used for surface mount processing.
又可称为晶圆电阻、圆柱型电阻、无引脚电阻、或无引线电阻，主要用于表面贴装加工过程。
RJM resistor MELF Resistors also can be called a wafer resistance, cylindrical-type resistance, non-pin resistance, or non-lead resistance, mainly used for surface mount processing.
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