有时,较低的口模温度会在口模内表面上生成一个冷却的树脂层,这个树脂层慢慢地移出到口模出口,然后与本体料流分离,从而引起积料。
Sometimes lower die temperatures can create a cool layer of resin on the inner surface of the die that creeps slowly to the die exit and then separates from the bulk flow, causing buildup.
有时,较低的口模温度会在口模内表面上生成一个冷却的树脂层,这个树脂层慢慢地移出到口模出口,然后与本体料流分离,从而引起积料。
Sometimes lower die temperatures can create a cool layer of resin on the inner surface of the die that creeps slowly to the die exit and then separates from the bulk flow, causing buildup.
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