第9.2节于2008年6月11日修订9.3一个通过一器件的确定的接地接触件或接地导线通路应该用电镀的或不电镀的铜或铜合金制成。
See Section 21. 9.2 revised June 11, 2008 9.3 An identified grounding contact, or grounding-conductor path through a device shall be of plated or unplated copper or copper-based alloy. Exception No.
第9.2节于2008年6月11日修订9.3一个通过一器件的确定的接地接触件或接地导线通路应该用电镀的或不电镀的铜或铜合金制成。
See Section 21. 9.2 revised June 11, 2008 9.3 An identified grounding contact, or grounding-conductor path through a device shall be of plated or unplated copper or copper-based alloy. Exception No.
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