抛光垫材料：适用于各种抛光模材料。
Polishing pad material: Suitable for all kinds of polishing materials.
抛光垫粗糙的表面有利于提高材料去除率。
Using the polishing pad with grooves or rougher surfaces can increase the material removal and planarization rate.
抛光垫修整是化学机械抛光的重要过程之一。
Polishing pad conditioning is very important for chemical mechanical polishing to improve the performances of a pad.
本发明涉及一种可导电的抛光垫及其制造方法。
The invention relates to a conductive polishing pad and a manufacturing method thereof.
还在寻找最好的抛光垫使用细痕和涡流的去除垫？
Looking for the best buffing pads to use with Scratch and Swirl B-Gone?
抛光垫是化学机械抛光(CMP)系统的重要组成部分。
Polishing pad is a very important component of the chemical-mechanical polishing (CMP) system.
可将不同密度的抛光单元定位在抛光垫表面的不同区域内。
Different densities of the polishing elements may be positioned within different areas of the surface of the polishing pad.
抛光垫；
另外，本发明还公开了形成抛光垫的方法以及用抛光垫抛光表面的方法。
In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.
抛光垫的性能主要由抛光垫的材料种类、材料性能、表面结构与状态以及修整参数等决定。
The performances of a polishing pad are determined by the type and properties of pad materials, the surface structure and state as well as the conditioning parameters.
抛光垫包括中心、围绕中心的内部区、从内部区到围绕内部区的外部区连接沟槽的过渡区。
The polishing pad comprises a center, an inner region surrounding the center, a transition region connecting grooves from the inner region to an outer region surrounding the inner region.
该抛光垫可用于抛光加工各种薄形工件，尤其适于加工热敏性材料、软材料、晶体材料等。
The polishing pad can be used for polishing and processing various thin workpieces, is particularly suitable for thermal sensitivity materials, soft material, crystal materials, and the like.
一种化学机械抛光垫，包含由(A)苯乙烯聚合物和(B)二烯聚合物构成的非水溶性基质。
A chemical mechanical polishing pad comprising a water-insoluble matrix which comprises (a) a styrene polymer and (b) a diene polymer.
本发明涉及一种具有阻绝层的抛光垫和其制造方法，所述抛光垫包括底材、阻绝层和研磨层。
The invention relates to a polishing pad with a barrier layer and a manufacturing method thereof, and the polishing pad comprises a substrate, the barrier layer and a grinding layer.
本发明提供一种抛光垫，在抛光垫具有抛光媒质的情况下，用于抛光磁的、光学的和半导体衬底中至少一种。
The invention provides a polishing pad useful for polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium with a polishing pad.
本发明提供了一种抛光垫，其可包括多个直径在大约5 - 80微米的范围内的可溶纤维，以及不可溶成分。
A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component.
分别采用聚氨酯抛光垫、聚四氟乙烯抛光垫、无纺布抛光垫抛光钽酸锂晶片，研究抛光垫材料性能对抛光效果影响。
To study the influence of pad material on polishing effect in polishing, polytetrafluoroethylene pad, non-woven fabric pad and polyurethane pad are selected.
半导体器件上铜层化学机械抛光(CMP)的第一道工序一般需要使用一块硬抛光垫，在磨去阻挡层的工序中要用到软垫。
Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.
在抛光工艺中，抛光液的种类、抛光垫的选择、抛光压力、温度、抛光盘转速、加工时间等诸多条件都是决定抛光质量的重要因素。
Thirdly, the parameters deciding the quality in polishing process are as follows: slurry, polish pad, pressure, temperature, rotation speed, wafering time, and so on.
移动抛光机面板上的应用轻至中等压力，保持垫湿，直到高光泽可见和所有剩下的就是一个完美的表面。
Move the polisher across the panel applying light to medium pressure, keeping the pad wet, until high shine is visible and all that is left is a perfect surface.
使用该研磨垫的抛光方法采用光学终点探测装置。
The polishing method using this abrasive pad employs an optical end-point detection device.
使用您旋转或DA（双动）抛光机，适用于深层思考XP或需要的产品上的CGMPT的蓝色，六角逻辑蓝超柔软高光泽上光垫。
Using your rotary or DA (Dual-Action) polisher, apply Deep reflections XP or desired product on a CG MPT BLUE, Hex-Logic Blue Ultra-Soft High Gloss Glazing Pad.
使用您旋转或DA（双动）抛光机，适用于深层思考XP或需要的产品上的CGMPT的蓝色，六角逻辑蓝超柔软高光泽上光垫。
Using your rotary or DA (Dual-Action) polisher, apply Deep reflections XP or desired product on a CG MPT BLUE, Hex-Logic Blue Ultra-Soft High Gloss Glazing Pad.
应用推荐