在第二部分工作中，我们对一定沉积条件下制备的纳米晶镍镀层样品进行了界面扩散处理并研究了界面的结构特征。
In the second part, under certain deposition conditions, interface diffusion treatments were carried out for nanocrystalline coating sample and the microstructure features are investigated.
并分析了铜在柱状和块状镍镀层中的扩散系数。
Diffusion characteristics of copper in lamellar and columnar nickel deposit are also determined.
铜在防渗铜镀层中的扩散系统是评价镀层防渗铜能力的重要参数。
Diffusion coefficient of copper in barrier coating is a considerable parameter for evaluating barrier ability.
电镀铜锡合金是一种合适的代镍镀层，它不使人体过敏，能满足防扩散性能的要求，且成本较低。
Cu Sn plating is a right substitute for nickel coating because it is not allergic to human body, can meet anti diffusion requirement and has a lower cost.
以镍、钴、钯镀层作为铜基体镀金的防渗铜中间层可以有效地防止铜原子扩散到金属表面。
Nickel, cobalt and palladium electrodeposits used as barrier layer between copper basis and gold deposit can effectively reduce migration of copper atom to gold upper deposit.
以镍、钴、钯镀层作为铜基体镀金的防渗铜中间层可以有效地防止铜原子扩散到金属表面。
Nickel, cobalt and palladium electrodeposits used as barrier layer between copper basis and gold deposit can effectively reduce migration of copper atom to gold upper deposit.
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