其上放置晶片的传送臂的表面具有在扇形区域中多个以等间距形成的抽吸孔。
A surface of the transporting arm on which a wafer is placed is provided with a plurality of suction holes formed at equal intervals in a fan-shaped region.
其上放置晶片的传送臂的表面具有在扇形区域中多个以等间距形成的抽吸孔。
A surface of the transporting arm on which a wafer is placed is provided with a plurality of suction holes formed at equal intervals in a fan-shaped region.
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