—墓碑技术：宾夕法尼亚州韦恩堡的一家公司，为墓碑市场推销一种硬币大小、封装在不锈钢中的微芯片。
Tombstone tech: A Waynesburg, Pa., company sells a coin-size, stainless steel-encased microchip for grave stone markets.
由于在印制电路板上的倒装芯片和CSP器件的紧凑设计，声音微图像己经成为检测这些封装的非常重要的一部分。
Because of the compact design of flip chips and CSP on PCB, acoustic micro imaging has become extremely important for inspecting these packages.
本论文研究了磁珠芯片中的电磁场模拟分析，以及两种关键工艺——基于UV-LIGA的平面电磁器件制作工艺和塑性材料微加工制作工艺。 在此基础上，设计、制作并封装了新型磁珠微芯片。
This thesis study the simulation of electromagnetic field of MB chip and two key fabrication processes—fabrication of planar electromagnetic devices based on UV-LIGA and polymeric microfabrication.
通过激光微焊接机理的研究，得出脉冲激光更适合MEMS芯片的焊接封装。
The mechanism of laser jointing was studied, and the conclusion that impulse laser is even more the same with MEMS encapsulation was duced.
通过激光微焊接机理的研究，得出脉冲激光更适合MEMS芯片的焊接封装。
The mechanism of laser jointing was studied, and the conclusion that impulse laser is even more the same with MEMS encapsulation was duced.
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