概述了在微细线路形成中湿式镀工艺的新开发，可以在改性聚酰亚胺膜上形成微细线路图形。
This paper describes new development of wet plating process in micro fine circuit formation. It can form micro fine circuit pattern on improved performance polyimide film.
概述了在微细线路形成中湿式镀工艺的新开发，可以在改性聚酰亚胺膜上形成微细线路图形。
This paper describes new development of wet plating process in micro fine circuit formation. It can form micro fine circuit pattern on improved performance polyimide film.
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