介绍了微电镀原理和设计了微电镀平台，设计了悬臂梁的微电镀工艺流程。
The fabricating process of the beam was designed after the micro -electroplating principle and the micro -electroplating plat form were introduced.
研究了脉冲电镀在微氰镀金，无氰镀金体系中脉冲频率、脉冲占空比对镀金层耐磨性的影响。
The effect of pulse frequency and pulse duration ratio on the abrasion resistance of gold coatings is investigated with pulse plating in cyanide free and trace cyanide baths.
以氢气析出造成的微裂纹为主。电镀工艺参数中温度对微裂纹的多少影响很大。
Of the electroplating technology parameters, temperature has a great in - fluence upon the number of microcracks.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
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