微电铸，又称精密电铸，是一种全新的微细加工技术。
As a new micro fabrication technology, micro electroforming I.
利用SU-8光刻胶制备电铸模和微电铸工艺，制造了二维微执行器原型。
The prototype of the micro actuator is fabricated by means of micro electroforming and SU-8 photolithography techniques.
本文主要阐述了LIGA技术的工艺过程，包括X射线深层光刻、微电铸和微复制工艺。
This article mainly explains the process of LIGA technology, which includes X-ray mask lithography, Micro-electroforming and Micro-copy.
因此本文以微电铸制作微流控片芯片的模具为基础对改善微电铸器件的均匀性进行理论和实验研究。
Therefore, theoretical and experimental research was carried out to improve uniformity of metal micro-mold insert used in microfluidic chips.
因此，对微电铸工艺进行深入研究，突破其工艺瓶颈，将对微加工工艺的应用和推广起着重要作用。
So, further research on it, especially removing its bottlenecks, will benefit its application and popularization remarkably.
由于电流波形对微电铸器件的质量有很大影响，本文从理论上分析了负向脉冲电流对铸层均匀性的改善作用。
Because of the great influence of current waveform on micro-device quality, the effect of negative current on surface finishing was studied theoretically.
采用线性电位扫描和电化学交流阻抗等电化学测量技术 ，对高深宽比掩膜条件下微电铸镍的电极反应动力学过程进行了初步研究。
The kinetics of the electrode reaction is preliminarily studied by linear potential sweep technique and electrochemical impedance while electrodepositing Ni for high aspect ratio structures.
由于负向电流可以腐蚀削减铸层表面微观突起的生长高度，因此周期换向脉冲电流微电铸与单向正脉冲电流微电铸相比更易获得较好的铸层均匀性。
Because the height of micro tips on cathode surface can be eroded by the negative current, surface finishing is better in the micro-electroforming by periodic reverse pulse current than pulse current.
利用SU -8光刻胶为主要材料，采用多级曝光和电铸金属实现3D结构的工艺技术，研制出了微针执行器的雏形器件。
The rudiments of microneedle actuator have been developed, which is mainly made of SU 8 photoresist, and its 3D construction is fabricated by multistep exposal and electroforming metal.
利用SU -8光刻胶为主要材料，采用多级曝光和电铸金属实现3D结构的工艺技术，研制出了微针执行器的雏形器件。
The rudiments of microneedle actuator have been developed, which is mainly made of SU 8 photoresist, and its 3D construction is fabricated by multistep exposal and electroforming metal.
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