帕洛马技术3500III执行全自动晶圆级封装和先进的微电子组装。
Palomar Technologies Model 3500-III performs fully automatic wafer scale packaging and advanced microelectronics assembly.
本文介绍了机载雷达用的微电子组装插件的可靠性设计和可靠性预测实例。
Practical examples of reliability design and prediction for a card-level micropackaging module in an airborne radar system are presented in this paper.
为此，必须研究采用先进的微电子组装技术取代落后的常规电子组装技术。
So it is necessary to research and develope the advanced microelectronic packaging to replace the conventional electronic packaging.
就应力—应变场有限元数值模拟在微电子组装焊点可靠性研究中的应用进行了综述。
The application of the finite element numerical simulation of stress-strain field distribution in the reliability study of the solder joints in microelectronic packaging has been reviewed.
令人瞩目的是微电子组装技术正在成为现代雷达及其他电子设备中最重要的关键技术之一。
It is noted that microelectronic packaging technology becomes one of the most important and challenging technologies in radar and all other electronic products.
随着微电子表面组装技术的迅猛发展，软钎料尤其是无铅钎料逐渐成为研究的焦点。
The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (SMT).
随着微电子表面组装技术的迅猛发展，软钎料尤其是无铅钎料逐渐成为研究的焦点。
The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (SMT).
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