微胶接技术非常适用于微机电系统产品的自动化装配过程。
Micro adhesive bonding technology shows great potential in the assembly of micro-electro-mechanical system (MEMS) products.
介绍按最小外接圆法、最大内接圆法评定圆度误差的一种快速、简便、易于微机实现的数据处理方法。
The data processing method for evaluation the circularity error with minimum circumscribed circle and maximum incircle was introduced. The method is quick and convenient to realize on computer.
介绍按最小外接圆法、最大内接圆法评定圆度误差的一种快速、简便、易于微机实现的数据处理方法。
The data processing method for evaluation the circularity error with minimum circumscribed circle and maximum incircle was introduced.
以及一连接部，连接该应力分散结构及该微机电系统装置的一基板。
The connection part is connected with the stress dispersion structure and a basal plate of the micro-electromechanical system device.
以及一连接部，连接该应力分散结构及该微机电系统装置的一基板。
The connection part is connected with the stress dispersion structure and a basal plate of the micro-electromechanical system device.
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