• 同时研究了芯片微带线间距互连、微带线制作材料可焊性焊接过程制造技术

    And other manufacturing technologies-interconnect between the chip and microstrip, manufacture of microstrip, solderability of available materials and soldering process are discussed.

    youdao

  • 同时研究了芯片微带线间距互连、微带线制作材料可焊性焊接过程制造技术

    And other manufacturing technologies-interconnect between the chip and microstrip, manufacture of microstrip, solderability of available materials and soldering process are discussed.

    youdao

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