同时研究了芯片与微带线间距的互连、微带线制作、材料的可焊性及焊接过程等制造技术。
And other manufacturing technologies-interconnect between the chip and microstrip, manufacture of microstrip, solderability of available materials and soldering process are discussed.
同时研究了芯片与微带线间距的互连、微带线制作、材料的可焊性及焊接过程等制造技术。
And other manufacturing technologies-interconnect between the chip and microstrip, manufacture of microstrip, solderability of available materials and soldering process are discussed.
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