所述镜头模 组和所述影像感测器固定于所述基板的同一表面。
The lens module and the image sensor are fixed on the same surface of the substrate.
所述影像感测器与所述基板电性连接，且收容在所述镜头模组内。
The image sensor is electrically connected with the substrate, and is accommodated in the lens module.
一种相机模组包括镜座、镜筒、影像感测器、电致变形元件和控制电路。
The invention provides a camera module, which comprises a lens base, a lens cone, an image sensor, an electro-deforming element and a control circuit.
所述镜座包括一镜座顶部与镜座底部，所述镜座底部与所述影像感测器承载于所述基板上。
The lens holder comprises a lens holder top part and a lens holder bottom part, wherein the lens holder bottom part and the image sensor are loaded on the substrate.
所述相机组件包括所述电路板和一个相机模组，所述相机模组包括一个镜头模组、一个影像感测器和一个基板。
The camera component comprises the circuit board and a camera module, wherein the camera module comprises a lens module, an image sensor and a substrate.
一种影像撷取装置，其包括：一个镜头、一个影像感测器、一个对焦单元、一个闪光灯及一个闪光灯控制单元。
An image capturing device includes a lens, an image sensor, a focusing unit, a flashlight and a flashlight control unit.
三维电脑的处理与组合、其介面感测器、影像和生物晶片以及其软体演算法程式设计。
Process and Fabrication of the 3D-Computer and its interface to sensors, images and bio-chip, and its software programming algorithm.
三维电脑的处理与组合、其介面感测器、影像和生物晶片以及其软体演算法程式设计。
Process and Fabrication of the 3D-Computer and its interface to sensors, images and bio-chip, and its software programming algorithm.
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