在完成整体结构圆片级真空封装的同时，通过引线腔结构方便地实现了中间电极的引线。
Through the silicon bonding, we achieve a wafer-level vacuum package, and the wire-bonding PAD is made after the fabrication is complete.
在完成整体结构圆片级真空封装的同时通过引线腔结构方便地实现了中间电极的引线。
Through the silicon bonding, the wafer-level vacuum package is achieved and the wire-bonding PAD is made after all the fabrication work is finished.
介绍了在单层陶瓷圆片的基础上实现单层陶瓷圆片带引线元件的片式化。
It was introduced how to change single layer ceramic disc components with leads into chip components on the basis of single layer ceramic discs.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
文章介绍了电路结构和工作原理以及消除引线电阻、电阻应变片的温度漂移和直流稳流电源供电质量对测量准确度的影响等问题。
It introduces circuit structure, operating principle and solves problems of temperature shift and dc constant-current power supply quality effect on measuring accuracy.
它主要是将设置在底板外侧相邻的各静触片的引线端彼此交叉排列；
Leading wire ends of adjacent static wafers which are arranged on the external side of a base plate are mutually crosswise arranged;
它主要是将设置在底板外侧相邻的各静触片的引线端彼此交叉排列；
Leading wire ends of adjacent static wafers which are arranged on the external side of a base plate are mutually crosswise arranged;
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