引线框架用铜带是集成电路的重要基础材料。
The copper alloy strip of lead frame is the fundamental material for integrate circuit.
研究探讨了改善半导体引线框架材料表面特性的方法。
This paper discusses the methods for improving surface characters of semiconduc-tive lead frame.
这导致引线框架和检测元件 之间的具有改善的电连接状态。
This results that the lead frame and the detection element have improved electrical connection.
本发明涉及一种高性能稀土电子引线框架材料及其生产方法。
The invention relates to a high performance rare-earth electric blaster fuse frame material and its production method.
集成电路引线框架、封装壳体的镀金、镀银、镀镍、镀锡工艺。
Gold, silver and nickel plating of IC lead frame and package shell.
机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.
自动冲切成形系统是半导体集成电路封装引线框架后的加工专用系统。
The automatic cutting system is a special equipment for processing the lead frames of semiconductor ICs after encapsulation.
研究了在铜合金表面电镀纯铜层保护膜对铜合金引线框架氧化失效的影响。
The effects of surface electroplate pure copper on oxidation failure of lead frame copper alloys for IC package were investigated.
铜合金引线框架材料因其高强高导电性能而成为集成电路框架材料的主体。
Copper alloys for lead frame are becoming leading factor in the lead frame materials for IC, because of its high strength and high conductivity.
数字视听、电容器、IC引线框架、继电器、光电器材等产销量均居中国前列。
Xiamen ranks among the top ones in China in terms of the production and sales of digital audio-video equipment, capacitors, IC fix frames, relays and photo- electric equipments.
结果表明，在时效处理前进行冷轧，可有效提高C194引线框架铜合金的导电性。
The results show that the cold rolling before aging treatment can enhance the conductivity of C194 copper alloy.
本发明可以有效利用金属银，降低成本，提高塑料与引线框架的结合力，达到防分层目的。
The invention can effectively use metal silver, reduces the cost, improves the bonding force between plastics and the lead frame, and achieves the purpose of anti-layering.
引线框架材料是电子工业不可或缺的重要组成部分，而铜合金框架材料又占其中的大部分。
Lead frames, especially those made of copper alloys, are among the most important parts for electronic IC devices.
在我国引线框架材料开发研制起步晚，基础薄弱的情况下，无疑既是一个挑战，又是个机遇。
There has a new demand for the lead frames, which is not only a good chance but also a challenge for our country under the condition of poor basis.
引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。
The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.
介绍了IC引线框架级进冲模的特点并着重讲述了其排样设计中的整形工位和模具结构中的卸料、微调和安全机构，可供精密级进冲模设计参考。
The traits of progressive die for IC lead frame have been introduced with emphasis on the ironing stage in layout design and stripping micro-adjustment, safety setup of the structure.
介绍了IC引线框架级进冲模的特点并着重讲述了其排样设计中的整形工位和模具结构中的卸料、微调和安全机构，可供精密级进冲模设计参考。
The traits of progressive die for IC lead frame have been introduced with emphasis on the ironing stage in layout design and stripping micro-adjustment, safety setup of the structure.
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