金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
通过对焊接工艺参数进行精密控制，实现了铜箔漆包线的单面直接焊接。
Through precise control of welding process parameters, one-side welding enameled wire to copper foil is realized.
介绍了提高铜箔粗化度及加强碳黑分散的工艺措施。
The technical measures to improve roughness copper foil and strengthen dispersion of carbon black were introduced.
该文简要地介绍了电解铜箔生产的溶铜工艺过程中多项反应的物理化学过程。
This paper brief introduces the Physical chemistry process of heterogeneous response in the technical process of copper dissolved for produced process of electrodeposited copper foil.
用市售铜箔和金胶，采用传统贴金工艺制备贴铜样品。
By using commercial copper foil and gold gluing oil, the sample of copper gilding was prepared with traditional gilding techniques.
用市售铜箔和金胶，采用传统贴金工艺制备贴铜样品。
By using commercial copper foil and gold gluing oil, the sample of copper gilding was prepared with traditional gilding techniques.
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