在芯片测试中，若引线焊盘上的铝层被探针扎穿，就会影响引线键合的牢固性和器件的可靠性。
If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.
将硅本征氧化层与硅热氧化层两种键合界面在退火过程中的行为进行了理论分析与比较。
Wafer pairs with bonding interface being native oxide or thermal oxide have different bonding behavior in the annealing process, which were investigated and compared.
这种疏松层便是大多数雪崩形成的根源，该层中大的杯状雪晶之间的键合很弱，非常容易断裂。
It's this weak layer that's at the root of most avalanches. The bonds between the large cup-shaped snow crystals in this layer are only weak and they break easily.
利用该多孔纳米结构作为键合层，由于纳米尺度效应，可以在较低的温度和压力下实现热压键合。
The porous nano-structure is used as a bonding layer, and thermocompression bonding can be realized at lower temperature and pressure due to the nano-scale effect.
在对微纳米通道进行热键合过程中，分别改变键合胶层厚度，键合温度，通道尺寸和键合时间四个条件进行了实验。
In the process of thermal bonding, experiments are carried out under different conditions such as variable polymer thick, temperature, channel width and time.
然而，它表面自然形成的二氧化钛膜层使其呈现出生物惰性，植入人体后难以和宿主骨间形成强有力的化学键合；
However, the natural titanium oxide film formed on its surface make it bio-inert, it is difficult to achieve chemical bond with bone and form new bone on their surfaces;
然而，它表面自然形成的二氧化钛膜层使其呈现出生物惰性，植入人体后难以和宿主骨间形成强有力的化学键合；
However, the natural titanium oxide film formed on its surface make it bio-inert, it is difficult to achieve chemical bond with bone and form new bone on their surfaces;
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