这就是我为什么喜欢尽可能多地将核心函数放入模块的模式，而将脚本只作为这些模块的小型封装器的多个原因之一。
That is one of the many reasons why I prefer the paradigm of placing as much core function into modules as possible, and having scripts be little more than small wrappers around these modules.
小型封装和纤薄的外形使该器件非常适合于印刷电路板区域和元件净空具有非常重要作用的应用。
The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium.
将传感器与信号调节电路利用厚膜电路工艺进行混合封装，完成了传感器的一体化，实现了传感器的小型化。
Sensor and signal regulating circuit is carried out through hybrid packaging by making use of thick-film circuit technology, which realizes integration and minimization of sensor.
另外由于其高效率，芯片发热量比较小，在封装时可以采用面积比较小的封装方案，这也有助于便携式系统的小型化。
Otherwise, because it's high efficiency, the temperature above chip will not very high, we can use smaller Package scheme, this will help to the miniaturization of portable device.
在此详细介绍了DIP - CIB模块的内部电路、半导体硅片技术、封装技术，以及如何配合专用的HVIC来实现通用变频器的小型化设计。
This paper describes the internal circuit of the DIP-CIB module, semiconductor chip technologies, package technologies and general purpose inverter design by using HVIC and the DIP-CIB module.
该RADIONOVAM10478射频天线模块是为L1波段GPS和辅助GPS系统相同的模块上的射频和天线结合了超小型单封装。
The RADIONOVA M10478 RF Antenna Module is an ultra-compact single package that combines the RF and antenna on the same module for both L1-band GPS and Assisted-GPS systems.
尤其是小型封装的射频芯片底部的大面积铺地很重要，既有利于散热和器件的工作可靠性，又能延长器件的寿命。
Multi-point grounding techniques combined with large areas of paving can enhance anti-interference ability. RF chip's bottom ground. is crucial to discharging heat prolonging the life.
该研究采用超小型或小型封装的可编程器件CPLD，焊接到特制的DIP封装的托座上，形成待编程的集成电路。
The study introduced the subminiature and pint-size encapsulation CPLD, which was welded to the tailor-made seat of DIP encapsulation. , and formed the integrated circuit that pending programmed.
该研究采用超小型或小型封装的可编程器件CPLD，焊接到特制的DIP封装的托座上，形成待编程的集成电路。
The study introduced the subminiature and pint-size encapsulation CPLD, which was welded to the tailor-made seat of DIP encapsulation. , and formed the integrated circuit that pending programmed.
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