小型封装中心钻。
设计用于小型封装区域，安全加热的电加热器在两小时内可使温度稳定上升。
Designed for small enclosed areas, Safe-Heat electric? Heaters provide a guaranteed temperature rise in two hours.
这些放大器采用小型封装选择(采用SOT - 23)以及MSOP和行业标准的SO封装。
These amplifiers are available in small package options (SOT-23) as well as the MSOP and the industry-standard SO packages.
小型封装和纤薄的外形使该器件非常适合于印刷电路板区域和元件净空具有非常重要作用的应用。
The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium.
拥有快速反应、小型封装等特色之新型电路设计可符合电路反应情形、组件数量、缩减空间等需求。
The response of this circuit, amount of components, and space constraints demanded a new circuit design with a faster response, smaller footprint, etc.
这就是我为什么喜欢尽可能多地将核心函数放入模块的模式，而将脚本只作为这些模块的小型封装器的多个原因之一。
That is one of the many reasons why I prefer the paradigm of placing as much core function into modules as possible, and having scripts be little more than small wrappers around these modules.
TMS320C 5402处理器具有高速度、低功耗、小型封装等特点，广泛用于通信领域的信号处理。
TMS320C5402 processor is used widely in communication filed for its characteristics of high speed, low power consumption and miniature encapsulation.
尤其是小型封装的射频芯片底部的大面积铺地很重要，既有利于散热和器件的工作可靠性，又能延长器件的寿命。
Multi-point grounding techniques combined with large areas of paving can enhance anti-interference ability. RF chip's bottom ground. is crucial to discharging heat prolonging the life.
该研究采用超小型或小型封装的可编程器件CPLD，焊接到特制的DIP封装的托座上，形成待编程的集成电路。
The study introduced the subminiature and pint-size encapsulation CPLD, which was welded to the tailor-made seat of DIP encapsulation. , and formed the integrated circuit that pending programmed.
GQ -继电器。超小型封装扁平极化继电器。操作功能单面稳定。线圈额定值12V直流。磁带和卷轴包装。表面贴装端子A型。
GQ-relay. Ultra-small package flat polarized relay. Operating function single side stable. Coil rating 12 V DC. Tape and reel packing. Surface-mount terminal a type.
AD 7812也提供三种封装：20引脚、0.3英寸宽、小型塑料双列直插式封装(小型DIP)； 20引脚、小形集成封装(SOIC)；以及20引脚超薄紧缩小型封装(TSSOP)。
The AD7812 is available in a small, 20-lead 0.3 "wide, plastic dual-in-line package (mini-DIP), in a 20-lead, small outline IC (SOIC) and in a 20-lead, Thin Shrink small outline package (TSSOP)."
Tessera还拥有实现电子设备小型化的芯片封装专利。
Tessera still owns patents for chip packaging that enable electronics miniaturization.
研制的小型无铅芯片载体封装便于大规模生产探测器，主要用途为便携式摄像机或头盔摄像机。
A small LCC package has been developed enabling a mass production of detectors for compact hand held or helmet mounted cameras.
将传感器与信号调节电路利用厚膜电路工艺进行混合封装，完成了传感器的一体化，实现了传感器的小型化。
Sensor and signal regulating circuit is carried out through hybrid packaging by making use of thick-film circuit technology, which realizes integration and minimization of sensor.
尺寸小型化与功率高密度化是当今电子封装器件两大主要发展趋势。
The two trends in the electronics packaging component field nowadays are the miniaturization in the size and high intensity in power.
树脂封装能缩小器件尺寸、减轻重量、降低成本、促进小型化。
Resin package is be used to decrease size of device, diminish weight, reduce costs and push for miniature.
在此详细介绍了DIP - CIB模块的内部电路、半导体硅片技术、封装技术，以及如何配合专用的HVIC来实现通用变频器的小型化设计。
This paper describes the internal circuit of the DIP-CIB module, semiconductor chip technologies, package technologies and general purpose inverter design by using HVIC and the DIP-CIB module.
另外由于其高效率，芯片发热量比较小，在封装时可以采用面积比较小的封装方案，这也有助于便携式系统的小型化。
Otherwise, because it's high efficiency, the temperature above chip will not very high, we can use smaller Package scheme, this will help to the miniaturization of portable device.
该器件提供两种封装：8引脚、0.3英寸宽、小型塑料或密封双列直插式封装（小型DIP）；以及8引脚小形集成封装（SOIC）。
The part is available in a small, 8-pin, 0.3" wide, plastic or hermetic dual-in-line package (mini-DIP) and in an 8-pin, small outline IC (SOIC)."
该RADIONOVAM10478射频天线模块是为L1波段GPS和辅助GPS系统相同的模块上的射频和天线结合了超小型单封装。
The RADIONOVA M10478 RF Antenna Module is an ultra-compact single package that combines the RF and antenna on the same module for both L1-band GPS and Assisted-GPS systems.
本实用新型涉及一种家用电器特别是一种小型食品真空封装机。
The utility model relates to a household appliance, particularly a vacuum packing machine for small food.
该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。
The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.
该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。
The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.
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