利用统计分析手段，对高功率二极管激光器封装中各工艺环节引起器件失效的原因进行了分析和归类。
Using statistics analysis method, diode laser failure states were classified and the causes of these diode laser failures were analyzed in every packaging process.
主要介绍了一种新型发光二极管（LED）自动封装机注胶系统的工作原理以及应用可编程控制器（PLC）和位控单元对其进行自动化的控制。
The article introduces the principle of the new LED automatic encapsulation equipment's infuse jelly system and automatic control by applying PLC and position control units.
制备了两种1W白光功率发光二极管（LED），这两种样品分别是对台湾和美国两家公司生产的蓝光芯片，涂敷相同荧光粉和透明硅胶封装而成。
Two kinds of 1 W white high power light emitting diode (LED) were made by packaging blue chips from Taiwan and US. The chips were coated by the same phosphor and transparent silica gel.
二极管是由一个PN结加上相应的引出端并封装管壳构成的。
Semiconductor diode is a PN junction together with the corresponding client leads and package composition shell.
激光二极管封装件中包括的监视二极管能兼容使用，而不管其接地类型。
The automatic laser power control circuit provides an advantage that a monitor diode included in the laser diode package can be compatibly used regardless of its ground type.
用此薄膜封装成白光发光二极管的性能良好。
The organic white light emitting diodes made of this film have super performance.
所述照明器为多管芯发光二极管，所述多管芯发光二极管封装了分别发红光、蓝光、绿光发光二 极管的管芯。
The lighter is one multiple die LED with red light emitting LED die, blue light emitting LED die and green light emitting LED die.
内透镜与所述发光二极管芯片一起封装，封装后的二极管模块包括底座；
The inner lens and chip of LED are sealed together. The sealed LED module includes base;
内透镜与所述发光二极管芯片一起封装，封装后的二极管模块包括底座；
The inner lens and chip of LED are sealed together. The sealed LED module includes base;
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