在F10键提供了紧凑的封装尺寸和低调的安装引线。
The F10 offers compact package dimensions and flying leads for a low-profile installation.
他dip18封装尺寸们从到这个城市就在这工作。
本发明缩小了半导体器件的封装尺寸，降低了产品成本。
The leadless packaging structure reduces the packaging size of the semiconductor device and reduces the product cost.
使用工业标准的封装尺寸，在M15中很容易安装在电机上无需费时调整或特殊工具。
Using industry standard package dimensions, the M15 is easily installed onto the motor without time-consuming adjustments or special tools.
UT9Q512E和UT9Q513K32分别采用的是36和68个管脚的封装，但尺寸略有不同。
The UT9Q512E and the UT9Q513K32 are available in 36- and 68-pin packages, but with slightly different dimensions.
减少元件和电路的几何尺寸，以达到增加电路的封装密度、减少功耗和减小信号传播延迟的目的。
The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays.
半导体器件，半导体晶片，芯片尺寸封装及制作和检测方法。
Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor.
各种元器件封装的尺寸，我们经常用到的一些封装，很实用。
Various components Packaging size, we often use the number of packages and practical.
尺寸小型化与功率高密度化是当今电子封装器件两大主要发展趋势。
The two trends in the electronics packaging component field nowadays are the miniaturization in the size and high intensity in power.
树脂封装能缩小器件尺寸、减轻重量、降低成本、促进小型化。
Resin package is be used to decrease size of device, diminish weight, reduce costs and push for miniature.
随着特征尺寸以及封装密度的增加，目前的封装冷却技术将很快不能适应。
As feature sizes and package densities increase, current package-level cooling techniques will soon become inadequate.
圆片级芯片尺寸封装（WL-CSP）工艺是在固态芯片尺寸玻璃外壳中装入芯片。
This wafer level chip size package (WL-CSP) process encases the die in a solid die-size glass shell.
随着微电子封装焊点尺寸的微型化，微连接尺寸效应对焊点的本构方程产生不可忽视的影响。
With the downsizing of solder joints in microelectronic packaging, size effect in micro-joining plays an more important role in the constitutive equation of the solder joints.
随着芯片集成度的增加和尺寸的减小，芯片引脚间距越来越细密化，微电子封装的精度要求越来越高。
As ICs continue to become more integrated and minimum feature sizes keep shrinking, the need for higher accuracy in fine pitch interconnect applications has become more important than ever.
备注：玻璃球面金属壳封装，产品照片及尺寸仅供参考，具体请以实物为准。
Note: Product picture & dimensions are for reference only. Detailed information is in accordana with the final product.
法兰及其接头。PN指定法兰用垫圈的尺寸。第3部分：非金属聚四氟乙烯封装垫圈。
Flanges and their joints. Dimensions of gaskets for PN-designated flanges. Part 3: non-metallic PTFE envelope gaskets.
微电子封装技术是一项重要的技术，这项技术直接影响最终电子产品的性能、外形尺寸、价格及可靠性能。
The microelectronic packaging technology is an important technology that affects performance, size, price and reliability of final electronic products.
干压成型的氧化铝陶瓷尺寸精确、绝缘和密封性能优良，广泛应用于电子元件封装。
The ceramic case widely apply in the electronic component seal because the good insulating ability and good sealing ability.
该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。
The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.
该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。
The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.
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