随着封装密度的进一步提高，其热失效问题也变得更加严重。
Along with the increase of package density, the issue of ASIC thermal failure has become more and more important.
集成电路技术中的一种修饰术语，表示元件体积小而且封装密度高。
In relation to an integrated circuit; a term that indicates small element size and high packing density.
随着特征尺寸以及封装密度的增加，目前的封装冷却技术将很快不能适应。
As feature sizes and package densities increase, current package-level cooling techniques will soon become inadequate.
随着微电子封装密度的提高，板级封装在跌落冲击载荷下的可靠性成为人们关注的焦点。
With increase in electronic package density, the reliability of a board-level package under drop impact load becomes a key issue.
减少元件和电路的几何尺寸，以达到增加电路的封装密度、减少功耗和减小信号传播延迟的目的。
The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays.
嵌入式无源元件技术能够实现对电容、电感等无源元件在印刷线路板内部的嵌入式封装，从而节省线路板表面空间、提高封装密度。
The embedded passive technology can save the real estate on the surface of the printed-circuits-boards (PCBs) by embedding the capacitors and inductors inside the PCBs.
尺寸小型化与功率高密度化是当今电子封装器件两大主要发展趋势。
The two trends in the electronics packaging component field nowadays are the miniaturization in the size and high intensity in power.
使用无引线陶瓷芯片载体(LCCC)可以达到高密度封装。
High density packaging can he achieved by using leadless ceramic chip carriers (LCCCs).
本文叙述了高密度封装的类型，介绍了它们的一般结构，并提供了封装的外形标准。
This paper presents some types of high density package, describes their general constructions and also shows the outline standards of these packages.
所述结构可具有较不复杂的聚焦、减小的串扰、较紧密的像素组装密度、提高的量子效率及晶 片级封装。
The structure may have less complex focusing, reduced crosstalk, tighter pixel packing density, increased quantum efficiency, and wafer-level packaging.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
重点介绍了高密度封装形式及应用前景。
Several types of high density packaging and their application prospects are emphatically described.
随着LSI和VLSI的飞速发展，LS I高密度封装技术变得越来越重要。
The high density packaging technology for LSI becomes more and more important as LSI and VLSI are developing rapidly.
传统的前向拱丝越来越难以满足目前封装的高密度要求，反向拱丝能满足非常低的弧高的要求。
Traditional forward looping technology is becoming hard to meet high-density requirements of IC Packaging, and reverse looping can comparatively achieve very low loop height.
本文对高密度封装中各结构成分的模型建立及分析作了讨论，根据这些方法编制了相应的程序。
Discussions are made about the modeling and analysis of various structural components in high density packaging. Relative programs have been tailored to suit these methods.
在3d -MCM(多芯片组件)封装设计中，大功率和高热流密度导致系统的散热成为关键技术之一。
In 3d-mcm (multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved.
这使电铸成为高密度应用，比如晶片封装优选技术。
This makes electroforming the preferred technique for high-density applications such as wafer bumping, where aperture counts are now more than 2 million.
论述了高密度封装的设计考虑及材料的选择。
It also reviews the design considerations and selection of the packaging materials.
高密度电子封装 HDEP?。
高密度电子封装 HDEP?。
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