第9.2节于2008年6月11日修订9.3一个通过一器件的确定的接地接触件或接地导线通路应该用电镀的或不电镀的铜或铜合金制成。
See Section 21. 9.2 revised June 11, 2008 9.3 An identified grounding contact, or grounding-conductor path through a device shall be of plated or unplated copper or copper-based alloy. Exception No.
测量绝缘电阻的例子包括测量印制板上走线之间的通路，或多芯电缆中导线之间的电阻。
Examples of insulation resistance measurements include measuring the path be tween traces on a printed circuit board or the resistance between conductors in a multi-conductor cable.
配置在电缆两端的模块通过幻象电路配置内的两对导线为一个靠近数据设备的电话机与一个PBX之间的电话信号提供一个幻象通路。
Modules at each end of the cable provide a phantom path for telephony signals between a telephone near the data set and a PBX, through both conductor pairs in a phantom circuit arrangement.
桥接：焊料连接，通常是导线间由焊料形成的多余的导电通路。
Solder Bridging: Solder connecting, in most cases, misconnecting, two or more adjacent pads that come into contact to form a conductive path.
桥接：焊料连接，通常是导线间由焊料形成的多余的导电通路。
Solder Bridging: Solder connecting, in most cases, misconnecting, two or more adjacent pads that come into contact to form a conductive path.
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