本发明的压电导电环氧树脂复合阻尼材料具有优良的消除噪声、振动和防静电等阻尼效应。
The piezoelectric and conductive epoxy resin composite damping material of the invention has good damping effects such as eliminating noise and vibration, preventing electrostatic and the like.
在电子工业中应用最广泛的导电胶粘剂是以银粉为导电填料以环氧树脂为粘合剂的体系。
The relation between the resistivity of conductive adhesive and the volume fraction of silver fillers was studied.
主要研究了金属导电浆料中常用的环氧树脂的固化。
The curing reaction of epoxy resin, which is common used in metal conductive paste, was studied.
环氧树脂组合物，导电薄膜形成方法，导电图案形成方法，以及多层布线板制造方法。
Epoxy resin composition, method for forming conductive film, method for forming conductive pattern and method for manufacturing multilayered wiring board.
利用IR、SEM等手段，较详细地研究了铜粉—环氧树脂体系中固化剂与铜粉的相互作用，并探讨了铜粉用量、形状对涂料导电性能的影响规律。
In the preparation of conductive paints of epoxy resin filled with copper powders the reaction between the curing agent and copper was studied in detail by means of SEM and IR.
以环氧树脂为基体，间苯二胺和氨基二苯甲烷的低融点混合物为固化剂，铜粉为导电填料，制备了热固化各向同性导电胶。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture ofm-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the con-ducting filler.
以环氧树脂为基体，间苯二胺和二氨基二苯甲烷的低融点混合物为固化剂，铜粉为导电填料，制备了热固化各向同性导电胶。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture ofm-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
介绍了以环氧树脂为基料，导电云母粉为导电体制成的浅色环氧油罐导静电涂料，该涂料具有良好的导电性、耐腐蚀性和机械性能。
Light colour anti-static coating for oil tank is formulated with epoxy resin as binder and conductive mica as conductor. The coating shows good conductivity, anti-corrosion and mechanical properties.
以酚醛树脂、环氧树脂与石墨作为基本原料，采用热压成型制备了几种导电复合材料。
Different kinds of conductive composites have been prepared from the raw materials of phenolic resin, epoxy resin and graphite by the hot pressing process.
以酚醛树脂、环氧树脂与石墨作为基本原料，采用热压成型制备了几种导电复合材料。
Different kinds of conductive composites have been prepared from the raw materials of phenolic resin, epoxy resin and graphite by the hot pressing process.
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